By E. BLEULER and R.O. HAXBY (Eds.)
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A . Sykes, W . L . S m i t h , a n d W . J. S p e n c e r , IEEE Int. Conv. Record P a r t I I , 78 (1967). 26 F . S a u e r l a n d a n d W . B l u m , IEEE Spectrum 5, 112 ( N o v . 1 9 6 8 ) . 27 R. W . G e o r g e , Proc. IRE 4 4 , 14 ( 1 9 5 6 ) . 28 D e p t . of D e f e n s e I n d e x of Specifications a n d S t a n d a r d s , o b t a i n a b l e from U . S. G o v e r n m e n t P r i n t i n g Office, W a s h i n g t o n , D . C . 2 0 4 0 2 . 29 F o r e x a m p l e , t h o s e issued b y E I A ( E l e c t r o n i c I n d u s t r i e s A s s o c i a t i o n ) , 2001 I S t r e e t , N W , W a s h i n g t o n D .
Film resistors have a deposited carbon, borocarbon, metal, or metal oxide film on an insulating core, and provide better performance in all respects than composition resistors. 005 to 0 . 0025 to 0 . 0 3 % / ° C positive for metal film units. T h e latter have excellent noise characteristics. A tolerance of 0 . 1 % can be obtained in metal film; such units are good substitutes for wirewound resistors unless extreme precision is necessary. Film resistors have good high-frequency characteristics u p to 10 M H z , and beyond for the lower resistance values.
I t is often difficult t o avoid ground loops, b u t their effect can be reduced b y minimizing their area. 42 1. PASSIVE LINEAR CIRCUIT ELEMENTS AND NETWORKS D c power distribution m e t h o d s are subject to some of the same considerations as the grounding system, particularly with respect to impedance coupling between low- and high-level circuits. T h e s e considerations, and those of more advanced grounding and shielding systems, 3 8 39 can be found in the l i t e r a t u r e . 3. C o m p o n e n t Mounting T h e main problems in constructing and packaging electronic circuits are those of component connection, system interconnection, and heat removal.
Electronic Methods by E. BLEULER and R.O. HAXBY (Eds.)