By William E. Hatfield, John H. Miller

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Batlogg, J. J. Krajewski, W. F. , P. Bordet, and D. E. Cox, Phys. Rev. Lett. 68, 3777 (1992). 13. -D. , Phys. Rev. Lett. 68, 530 (1992). 14. L. Forro, Phys. Lett. A 179, 140 (1993). 15. X. R6gi, J. Schneck, H. Savary, R. Mellet, and C. Daguet, Supercond. 1, 627 (1993). 16. W. Ashcroft and N. D. Mermin, Solid State Physics, Saunders, Philadelphia (1976), 346. 17. Z. Tan, M. E. Filipkowski, J. I. Budnick, E. K. Heller, D. L. Brewe, B. L. Chamberland, C. E. Bouldin, J. C. Woicik, and D. Shi, Phys.

Several different techniques have been used to achieve low-resistance electrical contacts to both single crystals and thin films. The simplest method involves direct contact of the measurement wire to the surface of the sample. This may be done using an electrically conductive paint or paste (usually containing silver) which binds the wire to the surface, and, once dry, holds down to cryogenic temperatures. The wire may also be secured by using a pressed pad of indium metal, which is soft and adheres well to the sample surface, or indium solder.

Franse, Phys. Rev. Lett. 71, 1895 (1993). 20. F. Sharifi, A. Pangellis, and R. C. Dynes, Phys. Rev. Lett. 67, 509 (1991). 21. J. Bardeen, L. N. Cooper and J. R. Schrieffer, Phys. Rev. 108, 1175 (1957); P. B. Allen, Nature 349, 396 (1991). 22. A. Golubov, M. R. Trunin, and S. V. Shulga, Physica C 213, 139 (1993); M. L. Horbach and W. Vansaarlos, Phys. Rev. B46, 432 (1992); N. Miyakawa, Y. Shiina, T. Kaneko, and N. Tsuda, J. Phys. Soc. Jap. 62, 2445 (1993). 23. Y. Yeshurun and A. P. Malozemoff, Phys.

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High-Temperature Superconducting Materials Science and Engineering by William E. Hatfield, John H. Miller

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